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Topics include flexible hybrid electronics, precision additive and R2R printing, printed and R2R photovoltaics, and hybrid CMOS SWIR sensors.
February 23, 2021
By: Anthony Locicero
Copy editor, New York Post
TechBlick wrote an article that highlights promising innovation and market trends in printed, hybrid, and in-mold electronics. The topics discussed include flexible hybrid electronics, precision additive and R2R printing, printed and R2R photovoltaics, and hybrid CMOS SWIR sensors. All trends highlighted in this article will be discussed by the key players in the field in TechBlick’s upcoming interactive LIVE online conferences and exhibitions taking place on March 10-11, 202...
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